Member ID： Member Password：     Product Name： FC-3000 Introduction： FC-3000 is the leading-edge single bath wet station for the next generation 300 mm wafer cleaning. The FC-3000 is a combination of our best cleaning technologies taken from our WS-620/820 multi-bath wet station series and the ultra clean processing capability of our F-WET single bath wet station series. The smaller, fixed footprint design also reduces cost-of-ownership (COO) by improving utilization of expensive cleanroom space. The operator interface is an easy to use Graphical User Interface running on a Windows NT operating system. Our unique wafer transfer hardware and software enables stable, high precision handling of large, heavy 300 mm wafer loads of up to 50 wafers per batch. The FC-3000 is provided with a built-in buffer unit and it is well suited for use in a highly automated mini environment installation. The FC-3000 has built in tools such as the schedule optimization function which allows you to easily monitor equipment productivity indices such as throughput rate and Cost-of-Ownership information such as chemical/DI water consumption, enabling low C.O.O. and stable processing. Product Name： MP-3000 Introduction： A Revolutionary Single Chamber Cleaning System Along with higher clean room efficiency, 300mm wafer applicability and shrinking design rules, today's semiconductor industry requiring ever more compact and high-precision cleaners. Optimization for 0.1μm and later CD generations demands cleaning equipment that incorporates new concepts, to ensure precise and reliable processing. The MP-3000 Spin Processor answers these demands by featuring a single chamber processing system. Wafer cleaning with several chemicals, rinsing and drying can now be accomplished in a single chamber, facilitating dry-in/dry-out processing. Moreover, high throughput is ensured by incorporating four process chambers. The MP-3000 supports a variety of cleaning processes including pre-process cleaning, oxide etching and post-process cleaning, and is ideal for small volume production of next generation devices. Product Name： MP-3000CB Introduction： Designed specifically for cleaning the back side and bevel edge after Cu processing. Dainippon Screen has developed a single-wafer cleaning system for 300mm wafers, MP-3000CB, which support leading edge Copper (Cu)interconnect cleaning applications in the back-end of the line (BEOL) process. This system is designed specifically for cleaning the back side and bevel edge of wafers after Cu processing. The MP-3000CB addresses two prevalent trends in the semicon- ductor industry. The first is the shift towards 300mm wafer diameter, which boosts the productivity of semiconductor fabs. The second is the adoption of Cu interconnect which, by virtue of the lower resistance of Cu compared to aluminum, enables semiconductor-manufacturers to build chips capable of higher processing speeds. Chip fabrication processes that use Cu interconnect demand higher levels of cleanliness for the back side and bevel edge of the wafer. The MP-3000CB process tool, an enhanced version of the MP-3000 answers the demands for higher cleanliness in next generation device production. It effectively cleans the back surface and bevel edge of wafers through the use of a modified wafer holding mechanism. Moreover, the bevel etch width and the area around the perimeter of the wafer rinsed by DI Water can be varied by changing wafer rotation speed. Having the ability to rinse the wafer at a width slightly greater than the bevel width, facilitates the removal of all residual chemicals from the bevel edge. Product Name： SS-3000 Introduction： Featuring increased processing capacity, C.O.O. reduction and user-friendly operation, the Spin Scrubber SS-3000 supports next generation processes using 300 mm wafers. While offering a reduced footprint, its cleaning performance has been greatly enhanced to pass newer, stricter evaluation criteria. Thus the SS-3000 is ideal for the increasingly reduced size of design rules, ensuring an ample process margin. Reduced chemical and DI water use combined with high speed processing will minimize your running costs. Maintenance and other operations have been extensively automated to facilitate overall operability. Product Name： VM-2100/3100 Introduction： The new Lambda Ace series of automatic film thickness measurement systems, the VM-2000/3000 series, is designed to be used with 200/300 mm diameter wafers. With the same popular features of the Lambda Ace series-excellent　measurement accuracy and repeatability, the VM-2000/3000 series is provided with a variety of optional features such as a pattern recognition function and auto transfer mechanism. In addition, its compact design allows a radical conservation of installation space. And through the adoption of Windows compatible software, operation is dramatically facilitated and a higher throughput is achieved.